BGA rework system QUICK 7610
BGA rework system QUICK 7610
BGA rework system QUICK 7610
BGA rework system QUICK 7610
BGA rework system QUICK 7610
BGA rework system QUICK 7610

BGA rework system QUICK 7610

7610
QUICK
In stock 2 pcs
64,716.00 CZK
Tax excluded
78,306.36 CZK Tax included

Product features
Weight:
36 kg
Dimensions:
80 x 58 x 52cm
Station power:
2400 W
Temperature range:
0-300°C
Supply voltage:
230 V
Type of station:
Rework
Maximum PCB size:
420 x 400mm
Heating type:
IR
Component sizes:
2 x 2 - 60 x 60mm
Communication with PC:
RS-232C
Lower preheating power:
1600W
Power of the upper radiator:
720W (vlnová délka IR záření je 2-8 mikrometrů)
Dimension of the bottom preheater:
260 x 260mm
 

Professional rework system using infrared radiation for heating. While the lower preheater ensures even and stable heating of the PCB, the upper infrared radiator intensively heats the area with the desired component. The temperature at the soldering point is sensed contactlessly by an IR sensor; in addition, an external thermocouple can be connected directly to the soldered board.

The upper infrared radiator is mounted on an arm with automatic, height-adjustable sliding. The system can be connected via USB to a PC and temperature profiles can be set, monitored and stored via the supplied IR soft. The set temperature, the actual temperature sensed by the IR sensor or the temperature sensed by an external thermocouple directly on the board under the component are displayed.

When the desired component is unsoldered or soldered, the connected fan automatically starts after the process to ensure that the board cools down gradually. The system is supplied complete with an adjustable work frame for mounting the PCB, including support pins and rails to prevent deflection of the board.

An undeniable advantage over hot air systems is the great versatility of these rework systems without the need to replace hot air nozzles. They find their application especially in the repair of motherboards, graphics, X-box, mobile phones, tablets, in the replacement of LCCC, BGA, QFP, PLCC housings, where soldering with the classic contact method is impossible or there is a risk of blowing away miniature components in the vicinity or directly on the chip body.

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