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Solder paste mixing machine MIX 500
MIX-500
Product features
230 V
1 nebo 2 kelímky max. 500 g
250g nebo 500g
Digitální řízení 0-99 min
35 dB
200 - 1400 ot./min
The MIX 500 is a solder paste mixer that ensures that the flux and the grains of the solder alloy are perfectly mixed evenly and without separation thanks to centrifugal - planetary mixing. This leads to optimum viscosity and stable printing.
Key Features:
No Bubbles: The special mixing process eliminates air bubbles in the paste (venting), thus preventing defects in printing and soldering.
Prolonged solder paste life: Proper mixing and minimized oxidation extends solder paste life and reduces waste.
Safety and cleanliness: Mixing takes place in a closed paste container. No manual contact is required and there is no contamination or hazardous spillage.
Key Features:
No Bubbles: The special mixing process eliminates air bubbles in the paste (venting), thus preventing defects in printing and soldering.
Prolonged solder paste life: Proper mixing and minimized oxidation extends solder paste life and reduces waste.
Safety and cleanliness: Mixing takes place in a closed paste container. No manual contact is required and there is no contamination or hazardous spillage.
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